High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical potting and encapsulation of transformers, reactors, and power electronics.
Structural adhesive formulations for aerospace composite bonding and metal-to-metal assembly.
High-voltage insulators and bushings requiring thermal stability and arc resistance.
Winding varnish and impregnation resin for motors, generators, and inductors.
Tooling and mold-making compounds for low-temperature prototyping and composite layup.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China