Highly reactive bisphenol-F-based epoxy resin with low viscosity for excellent processability.
Enhanced thermal stability and glass transition temperature (Tg) after curing with standard amine hardeners.
Superior chemical resistance, particularly to alkalis and solvents, compared to conventional bisphenol-A epoxies.
Low chlorine content (< 500 ppm), supporting high-purity applications in electronics and coatings.
Consistent batch-to-batch performance ensured by strict manufacturing controls under ISO 9001-certified processes.
Electronics encapsulation and underfill materials for semiconductor packaging.
High-performance protective coatings for industrial steel structures and marine environments.
Advanced composite matrices for aerospace and wind turbine blade components.
Electrical insulating varnishes and potting compounds for power electronics.
Adhesives requiring rapid cure response and long-term durability under thermal cycling.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chlorine Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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