High reactivity with standard amine and anhydride curing agents for rapid gelation and reduced cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure.
Low chloride content (<300 ppm) ensuring compatibility with sensitive electronic encapsulation applications.
Electrical insulation and potting of high-voltage transformers and busbar systems.
Structural adhesive formulation for aerospace composite bonding and repair.
Matrix resin for filament-wound pressure vessels and CFRP tanks.
Encapsulation of power electronics, IGBT modules, and EV battery pack components.
High-performance coating binder for corrosion-resistant industrial linings.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | <300 ppm |
| Volatiles Content | <0.3 wt% |
| Storage Stability | 12 months at 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China