High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior chemical resistance to alkalis, dilute acids, and aliphatic solvents after full cure.
Low chloride content (< 500 ppm), ensuring compatibility with sensitive electronic encapsulation applications.
Electrical insulation and potting compounds for transformers, reactors, and high-voltage components.
Structural adhesives in aerospace and automotive bonding applications requiring thermal stability.
Matrix resin for fiber-reinforced composites used in wind turbine blades and industrial tooling.
Coating systems for corrosion protection of steel pipelines and offshore infrastructure.
Encapsulants for LED modules and power semiconductor devices demanding optical clarity and low stress.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles (by weight) | ≤ 0.3% |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China