High-performance bisphenol-A based liquid epoxy resin with excellent mechanical strength and chemical resistance.
Low viscosity (12,000–14,000 cP at 25°C) enabling superior processability and easy handling in casting, impregnation, and coating applications.
Consistent epoxy equivalent weight (186–192 g/eq) ensuring reliable reactivity and predictable cure behavior with standard amine or anhydride hardeners.
Low chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and high-reliability composites.
Excellent adhesion to metals, glass, and fiber reinforcements—ideal for structural bonding and composite matrix systems.
Electrical insulation and potting of transformers, reactors, and medium-voltage electronic components.
Structural adhesive formulations for aerospace and automotive composite assemblies.
Matrix resin for filament-wound pressure vessels and FRP tanks requiring long-term hydrolytic stability.
High-gloss protective coatings for industrial flooring and chemical containment surfaces.
Encapsulation of sensors, PCBs, and power modules demanding thermal cycling durability and low dielectric loss.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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