Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO YD-011BC75 Epoxy Resin

KUKDO YD-011BC75 Epoxy Resin is a high-performance bisphenol-A-based liquid epoxy resin offering excellent adhesion thermal stability and chemical resistance. Designed for composites coatings and electrical encapsulation it features low viscosity superior flow and consistent reactivity. Its optimized molecular weight ensures reliable curing with amine or anhydride hardeners. Widely used in aerospace automotive and electronics industries this grade delivers robust mechanical properties and long pot life.
  • kukdo yd 011bc75 epoxy resin_4598a02e
  • kukdo yd 011bc75 epoxy resin_4598a02e

Features Of KUKDO YD-011BC75 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without requiring primers.

  3. Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and vacuum infusion.

  4. Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.

  5. Low chloride ion content (<500 ppm), ensuring high electrical insulation performance and corrosion resistance.

Typical Applications Of KUKDO YD-011BC75 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, inductors, and high-voltage insulators.

  2. Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.

  3. Matrix resin for filament-wound pressure vessels and CFRP pipes in oil & gas infrastructure.

  4. Coating systems for corrosion protection of steel substrates in marine and chemical plant environments.

  5. Prepreg production for high-performance laminates used in printed circuit board (PCB) base materials.

Specifications Of KUKDO YD-011BC75 Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free from gels and suspended matter
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)8,000–12,000 cP
Chloride Content<500 ppm
Softening Point12–16°C
Primary ApplicationsEncapsulation, structural adhesives, composite matrix, protective coatings


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