High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and vacuum infusion.
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Low chloride ion content (<500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation and potting of transformers, inductors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and CFRP pipes in oil & gas infrastructure.
Coating systems for corrosion protection of steel substrates in marine and chemical plant environments.
Prepreg production for high-performance laminates used in printed circuit board (PCB) base materials.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | <500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Encapsulation, structural adhesives, composite matrix, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China