High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and mixing with hardeners.
Superior chemical resistance to alkalis, dilute acids, and solvents after full crosslinking.
Good electrical insulation properties and low dielectric loss at high frequencies.
Structural adhesives for aerospace and automotive bonding.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
Encapsulants and potting compounds for electronic components and power modules.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Electrical laminates and prepreg formulations for printed circuit board (PCB) base materials.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free of sediment or haze |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China