High thermal stability with glass transition temperature (Tg) exceeding 120 °C after full cure.
Excellent chemical resistance to acids, alkalis, and solvents in demanding industrial environments.
Low viscosity formulation enabling easy processing, impregnation, and air-release during casting or laminating.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Optimized for dual-cure systems — compatible with both amine and anhydride hardeners for flexible formulation design.
Electrical encapsulation and potting of high-voltage transformers and power electronics.
Structural adhesives for aerospace composite bonding and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and corrosion-resistant piping systems.
High-performance coatings for marine and offshore infrastructure requiring long-term UV and salt-spray resistance.
Laminating resin for FR-4 grade printed circuit board (PCB) substrates and prepreg manufacturing.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, transparent, free of suspended particles or gels |
| Epoxy Equivalent Weight (EEW) | 180–195 g/eq |
| Viscosity at 25 °C | 12,000–16,000 cP |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | High-reliability electrical insulation, structural composites, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China