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Highly reactive liquid epoxy resin with low viscosity for excellent processability and wetting.
Designed for high-performance composite laminates requiring superior mechanical strength and thermal stability.
Compatible with standard amine and anhydride curing agents used in aerospace and industrial applications.
Low volatile organic compound (VOC) content, supporting environmentally responsible manufacturing practices.
Consistent batch-to-batch quality with strict control over epoxide equivalent weight (EEW) and chlorine content.
Aerospace structural composites, including primary and secondary airframe components.
High-strength wind turbine blade matrices for improved fatigue resistance and dimensional stability.
Automotive lightweighting solutions such as carbon fiber reinforced chassis and battery enclosures.
Industrial tooling and molds requiring low shrinkage and high heat distortion temperature (HDT).
Electrical insulation systems in high-voltage equipment and power transmission components.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxide Equivalent Weight (EEW) | 183–189 g/eq |
| Viscosity (25°C) | 12–16 Pa·s |
| Chloride Content (Total) | ≤ 700 ppm |
| Volatiles (105°C, 2 hrs) | ≤ 0.3 wt% |
| Key Features | High reactivity, low viscosity, low chloride, consistent EEW |
Q1: What is the primary function of HELOXY HD in epoxy formulations?
A: HELOXY HD is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is HELOXY HD suitable for high-gloss, low-VOC coatings applications?
A: Yes — as a low-volatility, non-reactive-diluent-alternative, HELOXY HD supports VOC reduction while maintaining film integrity and surface aesthetics in industrial and protective coating systems.
Q3: How does HELOXY HD compare to conventional glycidyl ether diluents in terms of reactivity?
A: HELOXY HD exhibits moderate reactivity — it participates fully in the epoxy cure cycle but generally requires standard amine or anhydride hardeners without necessitating accelerated cure schedules or elevated temperatures.
Q4: Can HELOXY HD be used in electrical encapsulation or potting compounds?
A: Yes — its low volatility, good compatibility with common epoxy resins, and ability to support low-viscosity, bubble-free processing make it well-suited for electrical insulation applications where controlled flow and minimal outgassing are critical.
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