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High-performance bisphenol-A based liquid epoxy resin with excellent chemical resistance.
Low viscosity enables easy handling, precise metering, and superior wetting of reinforcements.
Consistent reactivity profile optimized for reliable processing in casting, laminating, and adhesive formulations.
Excellent electrical insulation properties and high dielectric strength.
Good compatibility with standard amine and anhydride curing agents for tailored cure kinetics.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
Structural adhesives for aerospace and automotive composite bonding.
Laminating resins for printed circuit board (PCB) substrates and prepregs.
Casting resins for high-voltage insulators and industrial tooling.
Matrix resin in fiber-reinforced composites for wind energy and transportation components.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to water-white, clear liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Key Features | Low viscosity, high purity, consistent reactivity, excellent electrical properties |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
