English
Español
tiếng việt
русский
High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and long-term storage stability under ambient conditions.
Low chloride content (< 500 ppm), ensuring superior electrical insulation properties.
Optimized viscosity (10,000–14,000 cP at 25°C) for efficient processing in casting and laminating applications.
Reactive epoxide functionality enabling strong crosslinking with standard amine or anhydride hardeners.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Laminating resin for flame-retardant FR-4 printed circuit board (PCB) substrates.
Structural adhesives requiring high bond strength and environmental resistance.
Wind turbine blade bonding and composite matrix resin in aerospace-grade prepregs.
Protective coatings for corrosion-resistant industrial flooring and chemical tank linings.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–14,000 mPa·s (cP) |
| Chloride Content | ≤ 500 ppm |
| Volatile Content | ≤ 0.3 wt% |
| Softening Point | 12–16°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
