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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic chloride content for enhanced electrical insulation performance.
Optimized viscosity for improved processability in casting, laminating, and impregnation applications.
Superior adhesion to metals, glass fibers, and common industrial substrates.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Electrical insulation systems for transformers, reactors, and high-voltage bushings.
Structural composites in wind turbine blades and aerospace secondary components.
Prepregs and laminates for printed circuit board (PCB) substrates and FR-4 grade materials.
Potting and encapsulation compounds for sensors, power electronics, and LED modules.
High-performance coatings for corrosion protection of offshore and chemical processing equipment.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | 12–15°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
