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High reactivity with standard amine and anhydride curing agents for rapid gelation and reduced cycle times.
Excellent adhesion to metals, composites, and treated plastics under demanding thermal and mechanical conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air-release without solvent addition.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1 × 10¹³ Ω·cm).
Good chemical resistance to alkalis, diluted acids, and common solvents after full cure.
Electrical encapsulation and potting of transformers, inductors, and high-voltage sensors.
Structural adhesive formulation for aerospace composite bonding and automotive powertrain components.
Matrix resin for filament-wound pressure vessels and fiber-reinforced piping systems.
Insulating varnish and coating for motor windings and generator stators.
Base resin in high-performance composite tooling and mold-making applications.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, structural adhesives, composite matrix, electrical insulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
