High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation in composite processing.
Superior electrical insulation properties and low dielectric loss, suitable for high-reliability electronic encapsulation.
Good adhesion to metals, glass, and carbon fiber substrates without mandatory surface priming.
Electrical potting and encapsulation of transformers, reactors, and power modules.
Structural adhesive formulations for aerospace and automotive bonding applications.
Matrix resin for filament-wound composite pressure vessels and piping systems.
Coating base for corrosion-resistant linings in chemical storage tanks and piping.
Prepreg and infusion resin for wind turbine blade manufacturing.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Softening Point | 12–15°C |
| Chloride Content | ≤ 500 ppm |
| Hydrolyzable Chloride | ≤ 100 ppm |
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E-mail: wangxingqiang@ericwchem.com
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