Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMB-400T60 Epoxy Resin

KUKDO SMB-400T60 Epoxy Resin is a high-performance, low-viscosity, bromine-free flame-retardant epoxy resin designed for advanced PCB laminates and prepregs. It offers excellent thermal stability, superior electrical insulation, and outstanding adhesion to glass fabric. Compatible with standard curing agents, it meets UL94 V-0 requirements without antimony trioxide, supporting eco-friendly manufacturing.
  • kukdo smb 400t60 epoxy resin_031fd7a5
  • kukdo smb 400t60 epoxy resin_031fd7a5

Features Of KUKDO SMB-400T60 Epoxy Resin

  1. High thermal stability with glass transition temperature (Tg) up to 185°C after full cure.

  2. Excellent chemical resistance to acids, alkalis, and solvents in cured state.

  3. Low viscosity (3,200–3,800 cP at 25°C) enabling easy processing and excellent wetting of reinforcements.

  4. Outstanding electrical insulation properties with volume resistivity >1.0 × 10¹⁴ Ω·cm.

  5. Designed for high-reliability structural bonding and encapsulation in demanding industrial environments.

Typical Applications Of KUKDO SMB-400T60 Epoxy Resin

  1. Aerospace composite matrix resin for primary and secondary structural components.

  2. High-performance electrical encapsulation for power modules and EV battery systems.

  3. Structural adhesive formulation for metal-to-composite bonding in rail and wind energy applications.

  4. Prepreg impregnation resin for carbon fiber reinforced polymer (CFRP) laminates.

Specifications Of KUKDO SMB-400T60 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF) based epoxy resin
Product FormClear, amber-colored liquid
AppearanceHomogeneous, low-viscosity liquid without sediment or haze
Epoxy Equivalent Weight (EEW)178–184 g/eq
Viscosity (25°C)3,200–3,800 cP
Chlorine Content≤ 700 ppm
Volatile Content≤ 0.3 wt%
Storage Stability≥ 12 months at 25°C in sealed container


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