High thermal stability with glass transition temperature (Tg) up to 185°C after full cure.
Excellent chemical resistance to acids, alkalis, and solvents in cured state.
Low viscosity (3,200–3,800 cP at 25°C) enabling easy processing and excellent wetting of reinforcements.
Outstanding electrical insulation properties with volume resistivity >1.0 × 10¹⁴ Ω·cm.
Designed for high-reliability structural bonding and encapsulation in demanding industrial environments.
Aerospace composite matrix resin for primary and secondary structural components.
High-performance electrical encapsulation for power modules and EV battery systems.
Structural adhesive formulation for metal-to-composite bonding in rail and wind energy applications.
Prepreg impregnation resin for carbon fiber reinforced polymer (CFRP) laminates.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) based epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, low-viscosity liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 3,200–3,800 cP |
| Chlorine Content | ≤ 700 ppm |
| Volatile Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at 25°C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China