Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO YD-134L Epoxy Resin

KUKDO YD-134L Epoxy Resin is a low-viscosity, bisphenol-A-based liquid epoxy offering excellent adhesion, chemical resistance and mechanical strength. Ideal for composites, coatings and electrical encapsulation. Compatible with standard amine and anhydride hardeners. Meets RoHS compliance with low halogen content. Widely used in aerospace and automotive applications requiring high reliability and thermal stability.
  • kukdo yd 134l epoxy resin_8178c797
  • kukdo yd 134l epoxy resin_8178c797

Features Of KUKDO YD-134L Epoxy Resin

  1. High-purity bisphenol-A based liquid epoxy resin with low chlorine content.

  2. Excellent compatibility with common amine and anhydride curing agents.

  3. Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.

  4. Superior electrical insulation properties and thermal stability up to 130°C.

  5. Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.

Typical Applications Of KUKDO YD-134L Epoxy Resin

  1. Electrical encapsulation for transformers, reactors, and high-voltage insulators.

  2. Structural adhesives in automotive and aerospace composite bonding.

  3. Matrix resin for filament-wound pressure vessels and FRP piping systems.

  4. Coating formulations for corrosion-resistant tank linings and marine equipment.

  5. Prepregs and laminates in printed circuit board (PCB) base materials.

Specifications Of KUKDO YD-134L Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA)
Product FormClear, pale yellow liquid
AppearanceHomogeneous, transparent, free of suspended particles
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity (25°C)10,000–12,000 cP
Chloride Content≤ 800 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at ≤ 25°C in sealed containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *