High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical encapsulation for transformers, reactors, and high-voltage insulators.
Structural adhesives in automotive and aerospace composite bonding.
Matrix resin for filament-wound pressure vessels and FRP piping systems.
Coating formulations for corrosion-resistant tank linings and marine equipment.
Prepregs and laminates in printed circuit board (PCB) base materials.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free of suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China