Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion EPIKOTE WD-512 Waterborne Epoxy Resin

Hexion EPIKOTE WD-512 is a waterborne epoxy resin offering low VOC, excellent adhesion, and stable dispersion in aqueous systems. Designed for eco-friendly industrial coatings and concrete primers, it enables high-performance, solvent-free formulations with good chemical resistance and easy handling. Ideal for sustainable architectural and protective applications requiring durability and regulatory compliance.
  • hexion epikote wd 512 waterborne epoxy resin_a8e6501a
  • hexion epikote wd 512 waterborne epoxy resin_a8e6501a

Features Of Hexion EPIKOTE WD-512 Waterborne Epoxy Resin

  1. Low-VOC, environmentally compliant waterborne epoxy dispersion for sustainable coating formulations.

  2. Excellent chemical resistance and adhesion to properly prepared concrete and metal substrates.

  3. Good hydrolytic stability enabling extended shelf life and consistent performance in aqueous systems.

  4. Enables high-gloss, durable film formation without co-solvents or high-temperature curing.

  5. Compatible with common amine hardeners for ambient-cure, two-component waterborne epoxy systems.

Typical Applications Of Hexion EPIKOTE WD-512 Waterborne Epoxy Resin

  1. Industrial floor coatings for warehouses, manufacturing facilities, and cleanrooms.

  2. Waterborne primers and intermediate coats for steel and concrete infrastructure.

  3. Eco-friendly protective coatings for food processing and pharmaceutical environments.

  4. High-performance topcoats in architectural and commercial building applications.

  5. Base resin for low-emission, compliant industrial maintenance coatings.

Specifications Of Hexion EPIKOTE WD-512 Waterborne Epoxy Resin

Chemical TypeWaterborne bisphenol-A epoxy dispersion
Product FormLiquid dispersion
AppearanceOpaque white to off-white liquid
Solids Content (wt%)50–52%
pH (at 25°C)7.0–8.5
Viscosity (mPa·s, Brookfield RVT, #3 spindle, 20 rpm)200–600
Density (g/cm³, 25°C)1.02–1.06
Minimum Film Formation Temperature (MFFT)≈10°C


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