High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and resin transfer molding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin in filament-wound pressure vessels and CFRP piping systems.
Casting and potting of power electronics, including IGBT modules and EV battery management units.
Tooling and mold-making resins for low-volume composite prototyping and RTM tooling.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 9,000–11,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Halogen Content | Low halogen (≤500 ppm Cl, ≤500 ppm Br) |
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E-mail: wangxingqiang@ericwchem.com
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