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Low-viscosity liquid epoxy resin enabling excellent flow and wetting in demanding formulations.
High purity with consistent epoxide equivalent weight (EEW) for reliable reactivity and cure performance.
Excellent compatibility with a broad range of curing agents, including amines, anhydrides, and phenolics.
Superior electrical insulation properties suitable for high-reliability electronic encapsulation.
Good adhesion to metals, composites, and engineered substrates without requiring surface priming.
Electrical and electronic encapsulants for transformers, sensors, and power modules.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin for filament-wound composite pressure vessels and pipes.
Coating systems for corrosion protection of steel infrastructure and pipelines.
Formulation base for high-performance casting and potting compounds.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chlorine Content | ≤ 800 ppm (total chlorine) |
| Softening Point | Not applicable (liquid at room temperature) |
| Density at 25°C | 1.16–1.18 g/cm³ |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
