Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanmu SM609 Bisphenol A Epoxy Resin

Sanmu SM609 is a high-purity Bisphenol A epoxy resin from the Sanmu SM series, offering excellent adhesion, chemical resistance and thermal stability. Widely used in composites, coatings and electronic encapsulation, it features low viscosity, superior mechanical strength and consistent reactivity for reliable performance across demanding industrial applications.
  • sanmu sm609 bisphenol a epoxy resin_846958c7
  • sanmu sm609 bisphenol a epoxy resin_846958c7

Features Of Sanmu SM609 Bisphenol A Epoxy Resin

  1. High epoxy equivalent weight (EEW) of 480–520 g/eq, enabling excellent crosslink density and thermal stability.

  2. Low viscosity (12,000–16,000 cP at 25 °C), ensuring superior processability in casting, impregnation, and coating applications.

  3. Consistent batch-to-batch quality with strict control on hydrolyzable chlorine (< 500 ppm) and gel content (< 0.1%).

  4. Excellent adhesion to metals, composites, and cured thermosets without requiring aggressive surface pretreatment.

  5. Compatible with standard amine, anhydride, and phenolic hardeners for versatile formulation flexibility.

Typical Applications Of Sanmu SM609 Bisphenol A Epoxy Resin

  1. Electrical insulation systems for dry-type transformers and reactor windings.

  2. Structural adhesive formulations in aerospace and automotive composite bonding.

  3. High-performance encapsulants for power electronics and LED modules.

  4. Prepreg matrices for carbon fiber reinforced laminates used in wind turbine blades.

  5. High-voltage insulating coatings for busbars and switchgear components.

Specifications Of Sanmu SM609 Bisphenol A Epoxy Resin

Chemical TypeBisphenol A-based diglycidyl ether epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free from gels or particulates
Epoxy Equivalent Weight (EEW)480–520 g/eq
Viscosity (25 °C)12,000–16,000 cP
Hydrolyzable Chlorine≤ 500 ppm
Gel Content< 0.1%
Softening Point12–18 °C


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