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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via impregnation, casting, and resin transfer molding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure with standard diamines.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and fiber-reinforced pipes in chemical process industries.
Base resin for high-performance laminates used in printed circuit board (PCB) prepregs and copper-clad laminates.
Tooling and mold-making resins requiring dimensional stability and low exotherm during thick-section casting.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original packaging |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
