Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMF-2004 Epoxy Resin

KUKDO SMF-2004 Epoxy Resin is a high-performance liquid bisphenol-F type epoxy resin offering excellent adhesion thermal stability and chemical resistance ideal for composites coatings and electrical encapsulation applications widely used in aerospace automotive and electronics industries.
  • kukdo smf 2004 epoxy resin_9a98260e
  • kukdo smf 2004 epoxy resin_9a98260e

Features Of KUKDO SMF-2004 Epoxy Resin

  1. High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.

  2. Excellent chemical resistance to acids, alkalis, and solvents after full curing.

  3. Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, impregnation, and degassing.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good adhesion to metals, glass, and composite substrates without surface priming.

Typical Applications Of KUKDO SMF-2004 Epoxy Resin

  1. Electrical encapsulation of transformers, reactors, and high-voltage insulators.

  2. Structural adhesive formulations for aerospace and automotive bonding.

  3. Matrix resin for filament-wound pressure vessels and composite tanks.

  4. Castings and potting compounds for power electronics and sensor housings.

  5. Laminating resin for high-performance prepregs in wind turbine blade cores.

Specifications Of KUKDO SMF-2004 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceTransparent, slightly yellow, homogeneous liquid
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)11,000–13,000 cP
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability≥ 12 months at 20–25°C in sealed containers


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