High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to acids, alkalis, and solvents after full curing.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing, impregnation, and degassing.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, glass, and composite substrates without surface priming.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for filament-wound pressure vessels and composite tanks.
Castings and potting compounds for power electronics and sensor housings.
Laminating resin for high-performance prepregs in wind turbine blade cores.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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