Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO KD-264 Epoxy Resin

KUKDO KD-264 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin from KUKDO’s KD series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electronic encapsulation, it delivers low viscosity, superior curing reactivity and consistent batch-to-batch quality for demanding industrial applications.
  • kukdo kd 264 epoxy resin_8ae8b68e
  • kukdo kd 264 epoxy resin_8ae8b68e

Features Of KUKDO KD-264 Epoxy Resin

  1. Highly reactive bisphenol-A based liquid epoxy resin with excellent compatibility with standard amine and anhydride curing agents.

  2. Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, impregnation, and mixing without solvent dilution.

  3. Superior mechanical strength and chemical resistance after full cure, especially against alkalis and solvents.

  4. Consistent batch-to-batch quality with strict control of epoxide equivalent weight (EEW: 183–189 g/eq) and hydrolyzable chlorine content (<0.02 wt%).

  5. Optimized for high-gloss, low-shrinkage coatings and structural composites requiring dimensional stability.

Typical Applications Of KUKDO KD-264 Epoxy Resin

  1. Electrical insulation systems for dry-type transformers and cast resin bushings.

  2. High-performance protective coatings for marine, offshore, and industrial steel structures.

  3. Structural adhesives in aerospace and automotive bonding applications.

  4. Matrix resin for fiber-reinforced polymer (FRP) composites used in wind turbine blades and pressure vessels.

  5. Potting and encapsulation compounds for electronic components and LED modules.

Specifications Of KUKDO KD-264 Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceTransparent, homogeneous liquid, free from gel or sediment
Epoxide Equivalent Weight (EEW)183–189 g/eq
Viscosity (25°C)10,000–12,000 cP
Hydrolyzable Chlorine≤0.02 wt%
Softening PointNot applicable (liquid at room temperature)
Density (25°C)1.16–1.18 g/cm³


KUKDO KD-264 Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of KD-264 in epoxy formulations?

A: KD-264 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising final crosslink density or thermal performance.


Q2: Is KD-264 suitable for high-gloss coatings and electrical encapsulation applications?

A: Yes — its low volatility, good compatibility with common epoxy hardeners, and ability to support high crosslink efficiency make it well-suited for demanding coating, potting, and encapsulation systems where surface aesthetics and dielectric integrity are critical.


Q3: How does KD-264 compare to non-reactive diluents in terms of VOC content and film properties?

A: As a reactive diluent, KD-264 becomes chemically bound into the cured network, resulting in near-zero VOC contribution and superior retention of mechanical strength, chemical resistance, and adhesion compared to solvent- or non-reactive plasticizer-based alternatives.


Q4: What types of curing agents is KD-264 typically compatible with?

A: KD-264 demonstrates broad compatibility with amine-based hardeners (aliphatic, cycloaliphatic, and aromatic), as well as anhydride and phenolic curing systems — formulation adjustments may be needed depending on reactivity and stoichiometry requirements.


Q5: Can KD-264 be used in food-contact or potable water-related epoxy systems?

A: KD-264 is not pre-approved for direct food-contact applications; suitability for such uses depends on full system evaluation, including regulatory review of the complete cured formulation by end-use authorities.



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