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High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and impregnation.
Superior thermal stability with glass transition temperature (Tg) of cured system ≥125°C.
Low chloride content (<700 ppm), ensuring enhanced electrical insulation and corrosion resistance.
Electrical encapsulation and potting compounds for transformers and sensors.
Structural adhesives in automotive and aerospace composite bonding.
High-performance coatings for marine and industrial steel protection.
Matrix resin for filament-wound pressure vessels and pultruded profiles.
Base resin for flame-retardant printed circuit board (PCB) laminates.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | <700 ppm |
| Volatiles Content | <0.3 wt% |
| Storage Stability | 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
