High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature processing environments.
Superior adhesion to metals, glass, and composite substrates without requiring surface priming.
Low chlorine content (< 800 ppm), ensuring enhanced electrical insulation performance and reduced corrosion risk.
Free-flowing granular form enabling precise metering and uniform dispersion in compound formulations.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-performance prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives for aerospace and automotive bonding applications.
Composite matrix resins for carbon fiber reinforced polymer (CFRP) components.
Coating systems requiring chemical resistance and mechanical durability in industrial equipment.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Free-flowing off-white granules |
| Appearance | Uniform granular solid, no visible impurities |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melting Point | 85–92 °C |
| Softening Point | 88–95 °C (ring-and-ball method) |
| Chlorine Content | ≤ 800 ppm |
| Volatiles (150 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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