English
Español
tiếng việt
русский
High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good chemical resistance to alkalis, aliphatic hydrocarbons, and diluted acids after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in aerospace composite assemblies and wind turbine blade root joints.
Matrix resin for glass-fiber reinforced laminates used in marine and transportation components.
Potting and coating of power electronics modules requiring thermal stability up to 130°C.
Tooling and mold-making resins for low-volume production of precision composite parts.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Encapsulation, laminating, structural bonding, potting |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
