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High purity solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility for safe high-temperature processing.
Superior compatibility with common curing agents including amines and anhydrides.
Low chloride content (< 500 ppm) ensuring enhanced electrical insulation performance.
Free-flowing granular form enabling precise metering and uniform dispersion in compound formulations.
Electrical encapsulation compounds for power modules and high-voltage insulators.
High-performance powder coatings for automotive under-hood components.
Structural adhesives requiring elevated heat resistance and dimensional stability.
Prepregs and laminates in printed circuit board (PCB) base materials.
Composite matrices for aerospace and wind turbine blade applications.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Free-flowing off-white granules |
| Appearance | Uniform granular solid, no visible impurities |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 85–92 °C |
| Softening Point | 80–86 °C |
| Chloride Content | ≤ 500 ppm |
| Volatiles (150 °C, 2 h) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
