High molecular weight solid epoxy resin with excellent thermal stability and low volatility.
Consistent batch-to-batch performance due to tightly controlled manufacturing process.
Low chlorine content, supporting compliance with stringent regulatory requirements for electronics and coatings.
Good solubility in common organic solvents such as methyl ethyl ketone (MEK) and cyclohexanone.
Enables formulation flexibility for thermoset systems requiring high glass transition temperature (Tg) and mechanical strength.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance powder coatings for automotive and appliance substrates.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Structural adhesives requiring elevated heat resistance and dimensional stability.
Composite matrices for aerospace and wind energy applications.
| Chemical Type | Bisphenol-F based solid epoxy resin |
| Product Form | Off-white to light tan solid flakes or pellets |
| Appearance | Free-flowing granular solid |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 85–92 °C |
| Softening Point | 80–86 °C (ring-and-ball method) |
| Chlorine Content | ≤ 800 ppm |
| Volatiles (150 °C, 2 hrs) | ≤ 0.5 wt% |
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E-mail: wangxingqiang@ericwchem.com
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