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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without primer.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 180°C after full cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of high-voltage power modules and IGBTs.
Structural adhesive formulation for aerospace composite bonding.
Matrix resin for filament-wound pressure vessels and carbon fiber tanks.
Underfill and glob-top material for semiconductor packaging.
High-performance coating systems for offshore and chemical plant infrastructure.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
