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High-purity, low-viscosity liquid epoxy resin based on diglycidyl ether of bisphenol-A (DGEBA).
Excellent compatibility with a wide range of amine and anhydride curing agents for tailored cure profiles.
Superior electrical insulation properties and high dielectric strength suitable for electronic encapsulation.
Good adhesion to metals, composites, and cured thermosets without mandatory surface priming.
Low volatile organic compound (VOC) content and absence of reactive diluents—supports sustainable processing.
Electrical insulation and potting compounds for transformers, reactors, and busbar systems.
High-voltage composite insulators and bushings in power transmission infrastructure.
Structural adhesive formulations for wind turbine blade bonding and repair.
Matrix resin in filament-wound pressure vessels and aerospace secondary structures.
Encapsulation of sensors, PCBs, and high-reliability electronic modules.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Electrical insulation, structural composites, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
