High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, mixing, and impregnation in composite processes.
Superior electrical insulation properties and low dielectric loss, suitable for high-performance electronic encapsulation.
Good thermal stability with glass transition temperature (Tg) of cured system typically exceeding 120°C.
Electrical insulation and potting compounds for power electronics and transformers.
Matrix resin for filament-wound and pultruded fiberglass composites in structural applications.
Base resin for high-voltage insulators and bushings requiring arc resistance and tracking immunity.
Encapsulants for LED modules and automotive sensors demanding long-term reliability under thermal cycling.
Adhesives and laminating resins for printed circuit board (PCB) substrates and metal-to-composite bonding.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Color (Hazen) | ≤ 30 |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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