Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

MY721 Epoxy Resin

MY721 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin from the MY series by Mitsubishi Chemical. It offers excellent adhesion, chemical resistance and electrical insulation. Widely used in composites, encapsulants and advanced coatings. Low viscosity ensures easy processing and superior wetting. Meets stringent industrial standards for reliability and consistency.
  • my721 epoxy resin_84cc6ed9
  • my721 epoxy resin_84cc6ed9

Features Of MY721 Epoxy Resin

  1. High reactivity with amines and anhydrides, enabling rapid cure at ambient or elevated temperatures.

  2. Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.

  3. Low viscosity (8,000–12,000 cP at 25°C) for superior wetting and easy processing in casting, impregnation, and filament winding.

  4. Outstanding electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.

Typical Applications Of MY721 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.

  2. Structural adhesive formulation for aerospace and automotive composite bonding.

  3. Matrix resin in glass-fiber and carbon-fiber reinforced laminates for wind turbine blades and marine components.

  4. Casting and encapsulation of sensors, LED modules, and power electronics.

  5. Tooling and mold-making resins requiring dimensional stability and low exotherm.

Specifications Of MY721 Epoxy Resin

Chemical TypeBisphenol-F based diglycidyl ether epoxy resin
Product FormLiquid, solvent-free
AppearancePale yellow to amber transparent liquid
Epoxy Equivalent Weight (EEW)165–175 g/eq
Viscosity (25°C)9,500–11,500 cP
Softening PointNot applicable (liquid at room temperature)
Density (25°C)1.16–1.18 g/cm³
Halogen Content≤ 500 ppm (low halogen)


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