High reactivity with amines and anhydrides, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (8,000–12,000 cP at 25°C) for superior wetting and easy processing in casting, impregnation, and filament winding.
Outstanding electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace and automotive composite bonding.
Matrix resin in glass-fiber and carbon-fiber reinforced laminates for wind turbine blades and marine components.
Casting and encapsulation of sensors, LED modules, and power electronics.
Tooling and mold-making resins requiring dimensional stability and low exotherm.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Liquid, solvent-free |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 9,500–11,500 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Halogen Content | ≤ 500 ppm (low halogen) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China