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High thermal stability and excellent chemical resistance due to bisphenol-F backbone structure.
Low viscosity at room temperature, enabling easy processing and improved wetting of fillers and reinforcements.
Superior mechanical strength and toughness compared to standard bisphenol-A epoxy resins.
Reduced chloride content, supporting compliance with stringent electronics and food-contact material requirements.
Compatible with common amine, anhydride, and phenolic hardeners for versatile curing system design.
High-performance printed circuit board (PCB) laminates and prepregs.
Electrical insulation systems for transformers, bushings, and switchgear.
Structural adhesives requiring elevated heat resistance and dimensional stability.
Composite matrices for aerospace and wind turbine blade components.
Protective coatings for industrial tanks, pipelines, and marine infrastructure.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electronics encapsulation, high-voltage insulation, advanced composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
