High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Optimized viscosity (12,000–16,000 cP at 25°C) for excellent processability in casting, laminating, and impregnation.
Superior thermal stability and low volatility, supporting safe handling and extended pot life.
Excellent compatibility with standard amine, anhydride, and phenolic curing agents.
Low chlorine content (< 800 ppm), ensuring high electrical insulation performance and reduced corrosion risk.
Electrical insulation systems for dry-type transformers and reactor windings.
High-voltage encapsulation compounds for sensors, bushings, and switchgear components.
Laminates and prepregs in printed circuit board (PCB) base materials.
Structural adhesives requiring high bond strength and thermal resistance.
Composite matrix resin for aerospace and wind turbine blade components.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Volatility (1 hr at 150°C) | ≤ 0.5 wt% |
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E-mail: wangxingqiang@ericwchem.com
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