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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity at room temperature (12,000–14,000 cP at 25°C), enabling easy processing and improved filler wetting.
Superior mechanical strength and chemical resistance after full cure, especially to alkalis and solvents.
Low chloride content (< 700 ppm), supporting high reliability in electronic encapsulation and electrical insulation applications.
Electrical & electronic potting and encapsulation compounds.
High-performance structural adhesives for aerospace and automotive bonding.
Composite matrix resin for carbon fiber and glass fiber reinforced laminates.
Protective coatings for industrial flooring and corrosion-resistant linings.
Wind turbine blade adhesive and matrix systems requiring thermal stability and fatigue resistance.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
