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High-performance bisphenol-A based liquid epoxy resin with low viscosity for excellent processability.
Superior thermal stability and glass transition temperature (Tg) after curing with standard amine hardeners.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low ionic impurity content ensuring high electrical insulation resistance and reliability in electronic encapsulation.
Consistent batch-to-batch quality certified to ISO 9001 manufacturing standards.
Electrical potting and encapsulation of transformers, inductors, and power modules.
Structural adhesive formulations for aerospace composite bonding and repair.
High-voltage insulating coatings for busbars, switchgear components, and bushings.
Matrix resin in filament-wound pressure vessels and carbon fiber reinforced tanks.
Underfill material for flip-chip and advanced semiconductor packaging.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,500 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
