High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated cure conditions.
Low viscosity (10,000–14,000 cP at 25°C) enabling easy processing, impregnation, and high-filler loading.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, diluted acids, and common solvents after full cure.
Electrical encapsulation of transformers, reactors, and medium-voltage switchgear components.
Structural adhesive formulations for aerospace composite bonding and automotive under-hood assemblies.
High-performance potting compounds for power electronics, LED drivers, and EV battery module protection.
Matrix resin for filament-wound pressure vessels and corrosion-resistant FRP linings.
Base resin in high-gloss, abrasion-resistant industrial flooring systems.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–14,000 cP |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China