High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural potting compounds for power electronics and EV battery modules.
Core material in filament-wound composite pressure vessels and piping systems.
High-performance laminating resin for aerospace-grade prepregs and carbon fiber tooling.
Underfill and glob-top encapsulation for semiconductor packaging and MEMS devices.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Homogeneous, transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at 20–25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China