Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM638 Epoxy Resin

KUKDO SM638 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin from KUKDO’s SM series, offering excellent adhesion, chemical resistance and mechanical strength for composites, coatings and electrical encapsulation applications. It features low viscosity, superior flowability and reliable curing compatibility with common amine or anhydride hardeners.
  • kukdo sm638 epoxy resin_6501c9e1
  • kukdo sm638 epoxy resin_6501c9e1

Features Of KUKDO SM638 Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.

  5. Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure.

Typical Applications Of KUKDO SM638 Epoxy Resin

  1. Electrical encapsulation of transformers, reactors, and high-voltage insulators.

  2. Structural potting compounds for power electronics and EV battery modules.

  3. Core material in filament-wound composite pressure vessels and piping systems.

  4. High-performance laminating resin for aerospace-grade prepregs and carbon fiber tooling.

  5. Underfill and glob-top encapsulation for semiconductor packaging and MEMS devices.

Specifications Of KUKDO SM638 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, amber-colored low-viscosity liquid
AppearanceHomogeneous, transparent, slightly viscous liquid
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)12,000–15,000 cP
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability12 months at 20–25°C in sealed original container


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