English
Español
tiếng việt
русский
High epoxy equivalent weight (EEW) of 480–520 g/eq, enabling precise stoichiometric control in curing formulations.
Excellent thermal stability with glass transition temperature (Tg) up to 125 °C after full cure with standard diamine hardeners.
Low viscosity (12,000–16,000 cP at 25 °C), facilitating easy processing, degassing, and impregnation in composite manufacturing.
Superior chemical resistance to alkalis, dilute acids, and organic solvents post-cure.
Consistent batch-to-batch reproducibility meeting ISO 9001-certified production standards.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin for carbon fiber and fiberglass reinforced composites.
Electrical encapsulation and potting compounds for high-voltage insulators and PCB components.
Coatings for corrosion-resistant linings in chemical storage tanks and piping systems.
Wind turbine blade structural bonding and shear web infusion resins.
| Chemical Type | Bisphenol A-based liquid epoxy resin |
| Product Form | Clear, amber to light yellow viscous liquid |
| Appearance | Homogeneous, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 480–520 g/eq |
| Viscosity (25 °C) | 12,000–16,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25 °C in sealed original container |
Q1: What are the primary applications for Sanmu SM604?
A: Sanmu SM604 is widely used in high-performance protective coatings, industrial flooring systems, electrical encapsulation compounds, and structural adhesives where excellent chemical resistance, mechanical strength, and adhesion to diverse substrates are required.
Q2: How does SM604 compare to standard liquid bisphenol A epoxy resins in terms of reactivity and processing?
A: SM604 exhibits moderate reactivity typical of medium-molecular-weight bisphenol A epoxy resins, offering balanced pot life and cure speed under ambient or elevated temperature conditions. It is compatible with common amine, anhydride, and catalytic curing agents, supporting both room-temperature and thermal-cure formulations.
Q3: Is SM604 suitable for food-contact or potable water applications?
A: SM604 is not pre-certified for direct food-contact or potable water use. Formulators intending such applications must conduct full regulatory evaluation—including migration testing and compliance verification—based on the final cured system and applicable regional requirements.
Q4: What viscosity range can be expected for SM604 at 25°C?
A: SM604 is supplied as a low-to-medium viscosity liquid resin, generally ranging from approximately 10,000 to 15,000 cP at 25°C, facilitating easy handling, mixing, and incorporation into multi-component systems without excessive dilution.
Q5: Can SM604 be blended with other epoxy resins or reactive diluents?
A: Yes, SM604 is fully miscible with most standard bisphenol A/F epoxy resins, novolac epoxies, and common reactive diluents (e.g., glycidyl ethers), enabling formulators to tailor viscosity, flexibility, crosslink density, and thermal performance to specific application needs.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
