High purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity for easy handling, mixing, and impregnation into fiber reinforcements.
Superior electrical insulation properties and thermal stability after curing.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical laminates for printed circuit boards (PCBs) and insulating substrates.
Structural composites in wind turbine blades and aerospace components.
Encapsulants and potting compounds for high-voltage transformers and sensors.
Adhesives for metal-to-metal and metal-to-composite bonding in automotive assemblies.
Coating systems for corrosion protection of steel infrastructure and pipelines.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China