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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, and resin transfer molding.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure.
Low chloride content (< 500 ppm), minimizing corrosion risk in electronic and aerospace applications.
Aerospace composite tooling and mandrels requiring dimensional stability under thermal cycling.
High-voltage electrical insulation systems for transformers and bushings.
Structural adhesive formulations for automotive lightweight bonding of aluminum and CFRP.
Prepreg matrix resin for carbon fiber laminates used in wind turbine blades and sporting goods.
Encapsulation of power electronics and high-reliability LED modules.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 500 ppm |
| Volatiles (by weight) | < 0.3% |
| Storage Stability | 12 months at 25°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
