High-purity, low-chloride bisphenol-A based liquid epoxy resin for enhanced electrical insulation performance.
Excellent compatibility with standard amine and anhydride curing agents, enabling flexible formulation design.
Low viscosity (12,000–16,000 cP at 25 °C) for improved processability in casting, impregnation, and coating applications.
Superior thermal stability and hydrolytic resistance, supporting long-term reliability in demanding environments.
Consistent batch-to-batch quality with tightly controlled epoxide equivalent weight (EEW) and softening point.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Insulating varnishes and impregnating resins for motors, generators, and stator windings.
High-performance laminating resins for printed circuit board (PCB) prepregs and base materials.
Structural adhesives requiring elevated temperature resistance and dielectric integrity.
Composite matrix resin for aerospace and industrial tooling where dimensional stability is critical.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25 °C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16 °C |
| Color (Gardner) | ≤ 2 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China