High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good adhesion to metals, glass, and composites without requiring surface priming.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting.
High-performance laminating resins for FR-4 grade printed circuit board substrates.
Structural adhesives in aerospace and automotive composite bonding.
Wind turbine blade matrix resin for vacuum-assisted resin transfer molding (VARTM).
Coating systems for corrosion-resistant industrial tank linings and pipe coatings.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Homogeneous, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China