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High-purity bisphenol-A based liquid epoxy resin with low ionic chloride content.
Excellent thermal stability and low viscosity for enhanced processability in casting and impregnation.
Superior electrical insulation properties, ideal for high-reliability electronic encapsulation.
Low volatility and minimal odor, supporting safer handling in controlled manufacturing environments.
Consistent reactivity profile with standard amine and anhydride curing agents.
Encapsulation of power electronics and IGBT modules.
Insulating potting compounds for transformers and inductors.
High-voltage bushing and insulator casting resins.
Electrical laminates and prepreg systems for printed circuit board substrates.
Structural adhesives requiring high dielectric strength and thermal endurance.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
