High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good adhesion to metals, glass, and composite substrates after proper surface preparation.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting.
Structural adhesives in automotive and aerospace bonding applications.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
Coating systems for corrosion protection of steel infrastructure and pipelines.
Tooling and casting resins for precision molds and industrial prototypes.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Color (Gardner Scale) | ≤ 3 |
| Density (25°C) | 1.16–1.18 g/cm³ |
| Storage Stability | 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China