Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM-685 Epoxy Resin

KUKDO SM-685 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin from KUKDO’s SM series offering excellent adhesion thermal stability and chemical resistance widely used in composites coatings and electronic encapsulation applications.
  • kukdo sm 685 epoxy resin_4c405a50
  • kukdo sm 685 epoxy resin_4c405a50

Features Of KUKDO SM-685 Epoxy Resin

  1. High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.

  2. Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.

  3. Low viscosity (300–500 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.

  4. Superior adhesion to metals, composites, and cured concrete substrates.

  5. Good electrical insulation properties with high dielectric strength and volume resistivity.

Typical Applications Of KUKDO SM-685 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and power electronics.

  2. Structural adhesive formulations for aerospace and automotive composite bonding.

  3. High-performance flooring and protective coatings for industrial concrete surfaces.

  4. Wind turbine blade bonding and core filling in composite manufacturing.

  5. Tooling resins for molds used in RTM and vacuum infusion processes.

Specifications Of KUKDO SM-685 Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearanceColorless to pale yellow, transparent
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)350–450 cP
Chloride Content< 500 ppm
Volatiles Content< 0.3 wt%
Storage Stability12 months at < 25°C in unopened containers


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