High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.
Low viscosity (300–500 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior adhesion to metals, composites, and cured concrete substrates.
Good electrical insulation properties with high dielectric strength and volume resistivity.
Electrical encapsulation and potting of transformers, reactors, and power electronics.
Structural adhesive formulations for aerospace and automotive composite bonding.
High-performance flooring and protective coatings for industrial concrete surfaces.
Wind turbine blade bonding and core filling in composite manufacturing.
Tooling resins for molds used in RTM and vacuum infusion processes.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 350–450 cP |
| Chloride Content | < 500 ppm |
| Volatiles Content | < 0.3 wt% |
| Storage Stability | 12 months at < 25°C in unopened containers |
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E-mail: wangxingqiang@ericwchem.com
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