High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good adhesion to metals, glass, and composite substrates without requiring surface priming.
Electrical & electronics encapsulation and potting compounds.
High-voltage insulators and bushings for power transmission equipment.
Structural adhesives for aerospace and automotive bonding applications.
Composite matrix resin for fiber-reinforced laminates and wind turbine blade components.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Storage Stability | Stable for ≥12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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