High thermal stability with continuous service temperature up to 180 °C.
Excellent chemical resistance to strong acids, alkalis, and organic solvents.
Superior adhesion to metal substrates including aluminum, copper, and stainless steel.
Low ionic impurity content, ideal for high-reliability electronic encapsulation.
Reactive phenolic hydroxyl groups enable efficient crosslinking with conventional epoxy hardeners.
High-performance electrical laminates for printed circuit boards (PCBs).
Encapsulants and molding compounds for power semiconductor modules.
Thermal interface materials requiring long-term dimensional stability.
Coatings for corrosion protection in aggressive industrial environments.
Adhesives for structural bonding in aerospace and automotive electronics.
| Chemical Type | Novolac-type phenolic epoxy resin |
| Product Form | Pale yellow to amber solid flakes |
| Appearance | Free-flowing, homogeneous flakes |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Softening Point | 85–95 °C |
| Volatiles Content | ≤ 0.5 wt% |
| Chloride Ion Content | ≤ 500 ppm |
| Key Features | High char yield, low moisture absorption, halogen-free formulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China