High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing by casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace and automotive composite bonding.
Matrix resin in fiber-reinforced laminates for wind turbine blades and marine components.
Casting compound for LED housings, sensors, and precision electronic modules.
Coating system for corrosion protection of steel infrastructure in mild industrial environments.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly hazy when cold-stored |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, adhesive, composite matrix, protective coating |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China