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High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without extensive surface pretreatment.
Low viscosity (12,000–15,000 cP at 25°C) for improved wetting, impregnation, and ease of processing in casting and laminating.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Electrical potting and encapsulation for transformers, sensors, and power electronics.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for fiber-reinforced composites in wind turbine blades and industrial tooling.
Casting compounds for high-voltage insulators and decorative art pieces.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 30°C in unopened original containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
